Solder Paste Inspection (SPI) System Market Share, Revenue, Price, Growth Rate Ranking Analysis Report 2025-2031
2025年 11月 24日(月曜日) 15:08
On Nov 24, Global Info Research released "Global Solder Paste Inspection (SPI) System Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report includes an overview of the development of the Solder Paste Inspection (SPI) System industry chain, the market status of Solder Paste Inspection (SPI) System Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Solder Paste Inspection (SPI) System.
According to our (Global Info Research) latest study, the global Solder Paste Inspection (SPI) System market size was valued at US$ 332 million in 2024 and is forecast to a readjusted size of USD 568 million by 2031 with a CAGR of 8.1% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Solder paste inspection (SPI) is a critical process in the electronics manufacturing industry, ensuring the quality and reliability of printed circuit boards (PCBs) before they proceed to the soldering stage. Solder paste inspection is a process used in the assembly of electronic circuit boards. It involves checking the solder paste deposits on PCBs for volume, area, height, and misalignment before the components are placed and reflow soldering is performed. This inspection is typically carried out using automated optical inspection (AOI) systems or 3D inspection technologies. Solder Paste Inspection is a pivotal step in the PCB Assembly Process, especially in industries where precision and reliability are non-negotiable. It not only enhances the quality of the final product but also serves as a cost-saving measure by reducing the need for rework. As electronics continue to evolve and miniaturize, the role of SPI in maintaining manufacturing standards becomes even more significant.
In 2024, global sales of solder paste inspection (SPI) system reached 7,220 units, with an average price of US,000 per unit.
The solder paste inspection (SPI) system market is in a stage of rapid development, driven by the increasing demand for high precision and high reliability in the electronics manufacturing industry. With the rise of emerging markets such as smartphones, automotive electronics, and IoT devices, manufacturers are paying more and more attention to the quality of solder paste printing, which has led to the continuous expansion of the application scope of SPI systems. Currently, many companies are adopting advanced inspection technologies such as 3D imaging and automated analysis to improve production efficiency and reduce defect rates. Looking to the future, with the continuous advancement of technology and the improvement of industry standards, SPI systems are expected to be used in a wider range of fields, and the market prospects are broad.
Global key players of Solder Paste Inspection (SPI) System include Koh Young, Test Research, Inc (TRI), Sinic-Tek Vision Technology, CKD Corporation, Nordson Corporation, etc. The top five players hold a share about 61%. Asia-Pacific is the world's largest market for Solder Paste Inspection (SPI) System and holds a share about 54%, followed by Americas and Europe, with share about 25% and 17%, separately. In terms of product type, In-line SPI is the largest segment, accounting for a share about 92%. In terms of application, Consumer Electronics is the largest field with a share about 29 percent.
This report is a detailed and comprehensive analysis for global Solder Paste Inspection (SPI) System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Sample Report Request Solder Paste Inspection (SPI) System
https://www.globalinforesearch.com/reports/2409354/solder-paste-inspection--spi--system
Market segment by Type: In-line SPI、 Off-line SPI
Market segment by Application: Automotive Electronics、 Consumer Electronics、 Industrial、 Semiconductor、 Others
Major players covered: Koh Young、 Test Research, Inc (TRI)、 Sinic-Tek Vision Technology、 CKD Corporation、 Nordson Corporation、 SAKI Corporation、 Shenzhen JT Automation Equipment、 Viscom AG、 Mycronic (Vi TECHNOLOGY)、 MIRTEC CO., LTD.、 PARMI Corp、 Shenzhen ZhenHuaXing、 Pemtron、 ASC International、 ViTrox、 JUTZE Intelligence Technology、 Jet Technology、 Caltex Scientific、 MEK Marantz Electronics、 Shenzhen Chonvo Intelligence
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Paste Inspection (SPI) System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Paste Inspection (SPI) System, with price, sales, revenue and global market share of Solder Paste Inspection (SPI) System from 2020 to 2025.
Chapter 3, the Solder Paste Inspection (SPI) System competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Paste Inspection (SPI) System breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Solder Paste Inspection (SPI) System market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Paste Inspection (SPI) System.
Chapter 14 and 15, to describe Solder Paste Inspection (SPI) System sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
About Us:
Global Info Research
Web: https://www.globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
US: 001-347 966 1888
Email: report@globalinforesearch.com
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
According to our (Global Info Research) latest study, the global Solder Paste Inspection (SPI) System market size was valued at US$ 332 million in 2024 and is forecast to a readjusted size of USD 568 million by 2031 with a CAGR of 8.1% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Solder paste inspection (SPI) is a critical process in the electronics manufacturing industry, ensuring the quality and reliability of printed circuit boards (PCBs) before they proceed to the soldering stage. Solder paste inspection is a process used in the assembly of electronic circuit boards. It involves checking the solder paste deposits on PCBs for volume, area, height, and misalignment before the components are placed and reflow soldering is performed. This inspection is typically carried out using automated optical inspection (AOI) systems or 3D inspection technologies. Solder Paste Inspection is a pivotal step in the PCB Assembly Process, especially in industries where precision and reliability are non-negotiable. It not only enhances the quality of the final product but also serves as a cost-saving measure by reducing the need for rework. As electronics continue to evolve and miniaturize, the role of SPI in maintaining manufacturing standards becomes even more significant.
In 2024, global sales of solder paste inspection (SPI) system reached 7,220 units, with an average price of US,000 per unit.
The solder paste inspection (SPI) system market is in a stage of rapid development, driven by the increasing demand for high precision and high reliability in the electronics manufacturing industry. With the rise of emerging markets such as smartphones, automotive electronics, and IoT devices, manufacturers are paying more and more attention to the quality of solder paste printing, which has led to the continuous expansion of the application scope of SPI systems. Currently, many companies are adopting advanced inspection technologies such as 3D imaging and automated analysis to improve production efficiency and reduce defect rates. Looking to the future, with the continuous advancement of technology and the improvement of industry standards, SPI systems are expected to be used in a wider range of fields, and the market prospects are broad.
Global key players of Solder Paste Inspection (SPI) System include Koh Young, Test Research, Inc (TRI), Sinic-Tek Vision Technology, CKD Corporation, Nordson Corporation, etc. The top five players hold a share about 61%. Asia-Pacific is the world's largest market for Solder Paste Inspection (SPI) System and holds a share about 54%, followed by Americas and Europe, with share about 25% and 17%, separately. In terms of product type, In-line SPI is the largest segment, accounting for a share about 92%. In terms of application, Consumer Electronics is the largest field with a share about 29 percent.
This report is a detailed and comprehensive analysis for global Solder Paste Inspection (SPI) System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Sample Report Request Solder Paste Inspection (SPI) System
https://www.globalinforesearch.com/reports/2409354/solder-paste-inspection--spi--system
Market segment by Type: In-line SPI、 Off-line SPI
Market segment by Application: Automotive Electronics、 Consumer Electronics、 Industrial、 Semiconductor、 Others
Major players covered: Koh Young、 Test Research, Inc (TRI)、 Sinic-Tek Vision Technology、 CKD Corporation、 Nordson Corporation、 SAKI Corporation、 Shenzhen JT Automation Equipment、 Viscom AG、 Mycronic (Vi TECHNOLOGY)、 MIRTEC CO., LTD.、 PARMI Corp、 Shenzhen ZhenHuaXing、 Pemtron、 ASC International、 ViTrox、 JUTZE Intelligence Technology、 Jet Technology、 Caltex Scientific、 MEK Marantz Electronics、 Shenzhen Chonvo Intelligence
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Paste Inspection (SPI) System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Paste Inspection (SPI) System, with price, sales, revenue and global market share of Solder Paste Inspection (SPI) System from 2020 to 2025.
Chapter 3, the Solder Paste Inspection (SPI) System competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Paste Inspection (SPI) System breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Solder Paste Inspection (SPI) System market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Paste Inspection (SPI) System.
Chapter 14 and 15, to describe Solder Paste Inspection (SPI) System sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
About Us:
Global Info Research
Web: https://www.globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
US: 001-347 966 1888
Email: report@globalinforesearch.com
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
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