Integrated Heat Spreader (IHS) Market Opportunities, Growth Trends and Demand Analysis Report 2026-2032
2025年 12月 02日(火曜日) 19:08
On Dec 2, the latest report "Global Integrated Heat Spreader (IHS) Market 2026 by Manufacturers, Regions, Types and Applications, Forecast to 2032" from Global Info Research provides a detailed and comprehensive analysis of the global Integrated Heat Spreader (IHS) market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2026.
Get Report Sample with Industry Insights https://www.globalinforesearch.com/reports/3391919/integrated-heat-spreader--ihs
According to our (Global Info Research) latest study, the global Integrated Heat Spreader (IHS) market size was valued at US$ 769 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
An Integrated Heat Spreader (IHS) is the surface used to make contact between a heatsink or other thermal solution and a CPU or GPU processor.
Integrated Heat Spreader (IHS) - The metal “lid” of the CPU. This serves as a heat sink designed to distribute heat from the processor itself to a CPU cooler, as well as provide protection to the processor inside. This is the part of the CPU that is still exposed after being installed in a motherboard, and is the surface to which you apply thermal paste.
Integrated Heat Spreader (IHS) are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.
Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.
Global key Integrated Heat Spreader (IHS) players cover Shinko, Honeywell Advanced Materials, Jentech Precision Industrial, I-Chiun, Favor Precision Technology and Shandong Ruisi Precision Industry etc. In terms of revenue, the global three largest companies occupied for a share nearly 85% in 2024.
In terms of heat spreaders size, in past few years, the large size (35*35mm and Above) heat spreaders grew faster, the share will be 66.8% in 2031, from 51.15% in 2024.
In terms of materials, in 2024 the copper heat spreaders are domiating the market, hold 86.14% and in next six years, the stainless steel heat spreaders will grow faster.
In terms of application, in past few years, PC CPU/GPU is the largest application, hold 52.07% in 2024, while Server/Data Center are growing faster.
The future trends in technology will focus on personalized lifestyles, environmental sustainability, aging societies, and human-machine interface. As computer functions become more diverse, computation becomes more complex and faster, and new packaging processes emerge, the demand for heat spreaders with excellent heat dissipation capabilities will increase.
Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution.
With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.
Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.
This report is a detailed and comprehensive analysis for global Integrated Heat Spreader (IHS) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Integrated Heat Spreader (IHS) market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: Heat Spreader for FC (Flip Chip)、 Heat Spreader for BGA
Market segment by Application: PC CPU/GPU Package、 Server/Data Center/AI Chip Package、 Automotive SoC/FPGA Package、 Gaming Console、 Others
Major players covered: Shinko、 Honeywell Advanced Materials、 Jentech Precision Industrial、 I-Chiun、 Favor Precision Technology、 Niching Industrial Corporation、 Fastrong Technologies Corp.、 ECE (Excel Cell Electronic)、 Shandong Ruisi Precision Industry、 HongRiDa Electronics (HRD)、 TBT Co., Ltd
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Integrated Heat Spreader (IHS) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Integrated Heat Spreader (IHS), with price, sales quantity, revenue, and global market share of Integrated Heat Spreader (IHS) from 2021 to 2026.
Chapter 3, the Integrated Heat Spreader (IHS) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Integrated Heat Spreader (IHS) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment Integrated Heat Spreader (IHS) the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the Integrated Heat Spreader (IHS) sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and Integrated Heat Spreader (IHS) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Integrated Heat Spreader (IHS).
Chapter 14 and 15, to describe Integrated Heat Spreader (IHS) sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Integrated Heat Spreader (IHS)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
Contact Us:
Global Info Research
Web: https://www.globalinforesearch.com
Email: report@globalinforesearch.com
Get Report Sample with Industry Insights https://www.globalinforesearch.com/reports/3391919/integrated-heat-spreader--ihs
According to our (Global Info Research) latest study, the global Integrated Heat Spreader (IHS) market size was valued at US$ 769 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
An Integrated Heat Spreader (IHS) is the surface used to make contact between a heatsink or other thermal solution and a CPU or GPU processor.
Integrated Heat Spreader (IHS) - The metal “lid” of the CPU. This serves as a heat sink designed to distribute heat from the processor itself to a CPU cooler, as well as provide protection to the processor inside. This is the part of the CPU that is still exposed after being installed in a motherboard, and is the surface to which you apply thermal paste.
Integrated Heat Spreader (IHS) are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.
Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.
Global key Integrated Heat Spreader (IHS) players cover Shinko, Honeywell Advanced Materials, Jentech Precision Industrial, I-Chiun, Favor Precision Technology and Shandong Ruisi Precision Industry etc. In terms of revenue, the global three largest companies occupied for a share nearly 85% in 2024.
In terms of heat spreaders size, in past few years, the large size (35*35mm and Above) heat spreaders grew faster, the share will be 66.8% in 2031, from 51.15% in 2024.
In terms of materials, in 2024 the copper heat spreaders are domiating the market, hold 86.14% and in next six years, the stainless steel heat spreaders will grow faster.
In terms of application, in past few years, PC CPU/GPU is the largest application, hold 52.07% in 2024, while Server/Data Center are growing faster.
The future trends in technology will focus on personalized lifestyles, environmental sustainability, aging societies, and human-machine interface. As computer functions become more diverse, computation becomes more complex and faster, and new packaging processes emerge, the demand for heat spreaders with excellent heat dissipation capabilities will increase.
Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution.
With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.
Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.
This report is a detailed and comprehensive analysis for global Integrated Heat Spreader (IHS) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Integrated Heat Spreader (IHS) market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: Heat Spreader for FC (Flip Chip)、 Heat Spreader for BGA
Market segment by Application: PC CPU/GPU Package、 Server/Data Center/AI Chip Package、 Automotive SoC/FPGA Package、 Gaming Console、 Others
Major players covered: Shinko、 Honeywell Advanced Materials、 Jentech Precision Industrial、 I-Chiun、 Favor Precision Technology、 Niching Industrial Corporation、 Fastrong Technologies Corp.、 ECE (Excel Cell Electronic)、 Shandong Ruisi Precision Industry、 HongRiDa Electronics (HRD)、 TBT Co., Ltd
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Integrated Heat Spreader (IHS) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Integrated Heat Spreader (IHS), with price, sales quantity, revenue, and global market share of Integrated Heat Spreader (IHS) from 2021 to 2026.
Chapter 3, the Integrated Heat Spreader (IHS) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Integrated Heat Spreader (IHS) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment Integrated Heat Spreader (IHS) the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the Integrated Heat Spreader (IHS) sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and Integrated Heat Spreader (IHS) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Integrated Heat Spreader (IHS).
Chapter 14 and 15, to describe Integrated Heat Spreader (IHS) sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Integrated Heat Spreader (IHS)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
Contact Us:
Global Info Research
Web: https://www.globalinforesearch.com
Email: report@globalinforesearch.com
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