Copper Pillar Bump (CPB) Market Share, Revenue, Price, Growth Rate Ranking Analysis Report 2025-2031
2025年 11月 11日(火曜日) 10:56
On Nov 11, Global Info Research released "Global Copper Pillar Bump (CPB) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report includes an overview of the development of the Copper Pillar Bump (CPB) industry chain, the market status of Copper Pillar Bump (CPB) Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Copper Pillar Bump (CPB).
According to our (Global Info Research) latest study, the global Copper Pillar Bump (CPB) market size was valued at US$ 3322 million in 2024 and is forecast to a readjusted size of USD 5102 million by 2031 with a CAGR of 6.0% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Copper Pillar Bumps (CPB) are advanced micro-interconnect structures widely adopted in flip-chip and 2.5D/3D semiconductor packaging. A typical CPB consists of an electroplated copper column topped with a solder cap (commonly Sn or SnAg alloys), offering superior performance in electrical conductivity, thermal dissipation, mechanical stability, and form factor control compared to conventional solder balls. CPBs are classified based on pitch and bump height into standard CPB (pitch ≥ 400 μm), fine-pitch CPB (200–300 μm), and ultra-fine pitch CPB (< 100 μm), catering to diverse packaging formats such as FCBGA, FCLGA, SiP, CoWoS, EMIB, and HBM memory stacks. CPB fabrication involves key processes like photoresist patterning, copper electroplating, solder deposition or reflow, and wafer thinning, requiring high-precision control of aspect ratio and metallurgy.
Currently the key players of Copper Pillar Bump (CPB) include ASE (SPIL), Amkor Technology, TSMC, JCET , Intel, Samsung, SJSemi, HT-tech, Powertech Technology Inc. (PTI), ChipMOS TECHNOLOGIES, Chipbond Technology Corporation, Hefei Chipmore Technology, and Union Semiconductor (Hefei), etc. The global top ten players hold over 83 percent of global market.
Driven by the exponential growth of AI, high-performance computing (HPC), 5G, and advanced mobile SoCs, CPB technology is becoming the de facto standard in fine-pitch interconnects. Its advantages in achieving higher I/O density, lower z-height, and improved signal integrity make it critical for next-generation chiplets, heterogenous integration, and fan-out architectures. Emerging trends include sub-20 μm pitch micro-bumping, lead-free CPB solutions, and integration with RDL and redistribution layer (RDL)-first fan-out processes.
This report is a detailed and comprehensive analysis for global Copper Pillar Bump (CPB) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Pillar Type and by Wafer Size. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Sample Report Request Copper Pillar Bump (CPB)
https://www.globalinforesearch.com/reports/2424432/copper-pillar-bump--cpb
Market segment by Type: Cu Bar Type、 Standard Cu Pillar、 Fine pitch Cu Pillar、 Micro-bumps、 Others
Market segment by Application: 12 Inches (300 mm)、 8 Inches (200 mm)、 Others
Major players covered: ASE (SPIL)、 Amkor Technology、 TSMC、 JCET、 Intel、 Samsung、 SJSemi、 HT-tech、 Powertech Technology Inc. (PTI)、 Tongfu Microelectronics (TFME)、 Nepes、 LB Semicon Inc、 SFA Semicon、 International Micro Industries, Inc. (IMI)、 Raytek Semiconductor、 Winstek Semiconductor、 Hana Micron、 ChipMOS TECHNOLOGIES、 Chipbond Technology Corporation、 Hefei Chipmore Technology、 Ningbo ChipEx Semiconductor Co., Ltd、 UTAC
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Pillar Bump (CPB) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Pillar Bump (CPB), with price, sales, revenue and global market share of Copper Pillar Bump (CPB) from 2020 to 2025.
Chapter 3, the Copper Pillar Bump (CPB) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Pillar Bump (CPB) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Copper Pillar Bump (CPB) market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Pillar Bump (CPB).
Chapter 14 and 15, to describe Copper Pillar Bump (CPB) sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
About Us:
Global Info Research
Web: https://www.globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
US: 001-347 966 1888
Email: report@globalinforesearch.com
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
According to our (Global Info Research) latest study, the global Copper Pillar Bump (CPB) market size was valued at US$ 3322 million in 2024 and is forecast to a readjusted size of USD 5102 million by 2031 with a CAGR of 6.0% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Copper Pillar Bumps (CPB) are advanced micro-interconnect structures widely adopted in flip-chip and 2.5D/3D semiconductor packaging. A typical CPB consists of an electroplated copper column topped with a solder cap (commonly Sn or SnAg alloys), offering superior performance in electrical conductivity, thermal dissipation, mechanical stability, and form factor control compared to conventional solder balls. CPBs are classified based on pitch and bump height into standard CPB (pitch ≥ 400 μm), fine-pitch CPB (200–300 μm), and ultra-fine pitch CPB (< 100 μm), catering to diverse packaging formats such as FCBGA, FCLGA, SiP, CoWoS, EMIB, and HBM memory stacks. CPB fabrication involves key processes like photoresist patterning, copper electroplating, solder deposition or reflow, and wafer thinning, requiring high-precision control of aspect ratio and metallurgy.
Currently the key players of Copper Pillar Bump (CPB) include ASE (SPIL), Amkor Technology, TSMC, JCET , Intel, Samsung, SJSemi, HT-tech, Powertech Technology Inc. (PTI), ChipMOS TECHNOLOGIES, Chipbond Technology Corporation, Hefei Chipmore Technology, and Union Semiconductor (Hefei), etc. The global top ten players hold over 83 percent of global market.
Driven by the exponential growth of AI, high-performance computing (HPC), 5G, and advanced mobile SoCs, CPB technology is becoming the de facto standard in fine-pitch interconnects. Its advantages in achieving higher I/O density, lower z-height, and improved signal integrity make it critical for next-generation chiplets, heterogenous integration, and fan-out architectures. Emerging trends include sub-20 μm pitch micro-bumping, lead-free CPB solutions, and integration with RDL and redistribution layer (RDL)-first fan-out processes.
This report is a detailed and comprehensive analysis for global Copper Pillar Bump (CPB) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Pillar Type and by Wafer Size. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Sample Report Request Copper Pillar Bump (CPB)
https://www.globalinforesearch.com/reports/2424432/copper-pillar-bump--cpb
Market segment by Type: Cu Bar Type、 Standard Cu Pillar、 Fine pitch Cu Pillar、 Micro-bumps、 Others
Market segment by Application: 12 Inches (300 mm)、 8 Inches (200 mm)、 Others
Major players covered: ASE (SPIL)、 Amkor Technology、 TSMC、 JCET、 Intel、 Samsung、 SJSemi、 HT-tech、 Powertech Technology Inc. (PTI)、 Tongfu Microelectronics (TFME)、 Nepes、 LB Semicon Inc、 SFA Semicon、 International Micro Industries, Inc. (IMI)、 Raytek Semiconductor、 Winstek Semiconductor、 Hana Micron、 ChipMOS TECHNOLOGIES、 Chipbond Technology Corporation、 Hefei Chipmore Technology、 Ningbo ChipEx Semiconductor Co., Ltd、 UTAC
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Pillar Bump (CPB) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Pillar Bump (CPB), with price, sales, revenue and global market share of Copper Pillar Bump (CPB) from 2020 to 2025.
Chapter 3, the Copper Pillar Bump (CPB) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Pillar Bump (CPB) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Copper Pillar Bump (CPB) market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Pillar Bump (CPB).
Chapter 14 and 15, to describe Copper Pillar Bump (CPB) sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
About Us:
Global Info Research
Web: https://www.globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175
US: 001-347 966 1888
Email: report@globalinforesearch.com
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
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